Silicon Labs (Silabs) IoT & Connectivity Solutions on ICGOODFIND SiteMap
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- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- STMicroelectronics Issues $1.5B Convertible Notes to Refinance Debt
- Marvell Unveils Optical Interconnect for Cross‑Region AI Compute – Ara 1.6T and Teralynx T100 Switch
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- AMD Sweeps Amazon US CPU Best‑Seller List – Top 15 All AMD, Zero Intel
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- Google Orders >3 Million Intel‑Made TPUs, Intel Stock Jumps 13%
- Microchip Launches dsPIC33CK Value DSC – Low‑Cost, High‑Performance Real‑Time Control
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
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- WSTS Raises 2026 Semiconductor Forecast to $1.51T, Memory up 250%
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Quantinuum Upsized IPO to $1.46B, Valuation Hits $14.3B on Strong Demand
- NXP SA5775AD: A Comprehensive Overview of its High-Performance Radar System-on-Chip (SoC) Architecture
- NXP BZT52H-B18 Zener Diode: Key Features, Applications, and Technical Specifications
- NXP 74HC590D: An 8-Bit Binary Counter with Output Register and Asynchronous Reset
- NXP BYV25D-600: A Comprehensive Technical Overview of the 600V Ultrafast Rectifier
- NXP 74HC74D,652: A Comprehensive Technical Overview of the Dual D-Type Flip-Flop IC
- NXP BUK768R3-60E: A High-Performance 60 V Automotive TrenchMOS Transistor
- NXP BYV29-400: The High-Performance Ultrafast Rectifier for Power Conversion Systems
- Intel Debuts 18A Xeon 6+, E835 Ethernet, and Xe3P GPU at Taipei Show
- NXP BYC10-600P: A Comprehensive Technical Overview of the 600V Schottky Rectifier
- Maxio’s First UFS 3.1 Controller Ships to Major China Customers, PCIe 5.0 Enterprise SSD Controller in Test
- TrendForce Raises 2027 Memory Market Forecast to $1.28T, Driven by Agentic AI
- Loongson Plans $317M Private Placement, LoongArch CPU Shipments Top 1 Million
- Kioxia Delays BiCS10 3D NAND Mass Production to 2027, Boosts Density 59%
- The NXP BLF6G20S-45 is a high-performance N-channel enhancement-mode lateral MOSFET (LDMOS) power transistor engineered for demanding RF applications. Designed to operate in the frequency range from 1
- The NXP BLF8G22LS-140 is a 140-watt LDMOS RF power transistor engineered for demanding industrial, scientific, and medical (ISM) applications. Operating in the 2000 to 2200 MHz frequency range, it is
- BLF8G27LS-140: NXP's High-Power LDMOS Transistor for 2.7 GHz RF Applications
- BLF6G22-45: NXP's 4.5 GHz 150W LDMOS RF Power Transistor for Industrial and Scientific Applications
- The NXP MCF54455CVP200 is a highly integrated system-on-chip (SoC) microcontroller based on the enhanced V4 ColdFire core, operating at speeds up to 200 MHz. This 32-bit processor is engineered for co
- The NXP MCIMX6G3CVM05AA is a system-on-chip (SoC) microprocessor belonging to the renowned i.MX 6 series, specifically the i.MX 6DualLite family. This component is built on an advanced ARM Cortex-A9 a
- NXP MC9S12XHZ256CAG: A Comprehensive Technical Overview of the 16-bit Hybrid Microcontroller
- NXP BLF6G22-180PN: A High-Power LDMOS Transistor for 1800-2000 MHz Cellular Infrastructure Applications
- Panasonic, Kemet Raise Capacitor Prices Up to 65% as AI Server Demand Tightens Supply
- Russia Turns to Chinese AI Chips for GigaChat as Western Sanctions Bite
- Ex-Samsung Exec Predicts Memory Chip Prices to Drop in H2 2027 as China Ramps Capacity
- Anlogic Launches ELF5 and Phoenix 1P FPGAs, Shifts from Local Substitute to Industry Leader
- Xiaomi Confirms New Xuanjie Chip in 2026, First Gen Surpassed 1M Shipments
- NXP NTB0102GT: A 2-Bit Bidirectional Voltage-Level Translator with Auto Direction Sensing
- NXP TJA1040T/N1 High-Speed CAN Transceiver: Features, Applications, and Design Considerations
- NXP MCF52110CAE66: A Comprehensive Technical Overview of the ColdFire V1 Embedded Processor
- NXP PCA9673PW: A Comprehensive Guide to the Low-Voltage 16-Bit I²C-Bus I/O Expander
- NXP BT169: A Comprehensive Guide to the Standard Logic Level Thyristor
- Unveiling the NXP SAA1064/N2: A Comprehensive Guide to the I²C-Controlled 4-Digit LED Driver
- Apple Taps Intel’s 18A-P for A/M Series Chips, Ending TSMC’s Exclusive Grip
- NXP 74LVC2G08GT: A High-Performance Dual 2-Input AND Gate in Miniature Packaging
- Leveraging the NXP MCIMX6X4EVM10AB Evaluation Kit for Advanced Embedded Systems Development
- Microchip Launches LAN878x/LAN888x Single-Pair Ethernet PHYs with MACsec for Automotive and Industrial Use
- SG Micro Launches SGM51633S2: 16-Bit SAR ADC with 333ns Delay and 93dB SNR
- indie Semiconductor Buys ams OSRAM’s CIS Business for €40M
- NXP 74ALVC16245DGG: 16-Bit Bidirectional Transceiver with 6V Tolerant Inputs/Outputs and 3-State Outputs
- NXP TDA3629T/YM/W: A Comprehensive Technical Overview and Application Note
- NXP TDA3663/N1: A Comprehensive Overview of the Automotive Voltage Regulator IC
- NXP 74HC573PW-Q100: Octal D-Type Transparent Latch with 3-State Outputs for High-Performance Digital Systems
- NXP PHPT60415NY: A Comprehensive Technical Overview of this High-Performance IGBT Module
- NXP SPC5606SF2VLQ6 32-Bit Power Architecture Microcontroller for Automotive Applications
- NXP SAF7751HV/N205W: Advanced Single-Chip Car Radio and Audio System-on-Chip Solution
- NXP PTVS10VU1UPA: A Comprehensive Technical Overview of its Key Features and Applications
- Global Semiconductor Packaging Market to Hit $618.9B, Fueled by AI and EVs
- World’s Largest MEMS Foundry Silex Lists on Nasdaq Stockholm
- Arm Q4 Revenue Hits $1.49B Record – AI Drives Royalty Surge
- AMD Q1 Net Profit Jumps 95% – Samsung Breaks $1 Trillion Market Cap
- The NXP SJA1105RELY is a highly integrated, 5-port gigabit Ethernet switch designed specifically for industrial applications requiring deterministic real-time communication and ultra-high reliability.
- NXP PCA9547PW,118: A Comprehensive Technical Overview of the 8-Channel I²C Bus Multiplexer
- NXP 74HC126PW: Quad Buffer Gate with 3-State Outputs for Bus-Oriented Applications
- NXP MC33FS8410G3ES: A Comprehensive System Basis Chip for Automotive Body Domain Controllers
- NXP 74AHC1G09GV: A Single 2-Input AND Gate with Open-Drain Output for Modern Logic Design
- MCIMX6S6AVM08ADR: NXP's i.MX 6 Series Microcontroller for Embedded Systems Design
- NXP TDA8035HN/C1,118: A Comprehensive Technical Overview and Application Note
- NXP IP4254CZ8-4-TTL: A 4-Bit ESD-Protected Level Translator for High-Speed Digital Interfaces
- Renesas Q1 Operating Profit Soars 49.6% – Data Center & Auto Drive Beat
- NXP MPX4250A: A Comprehensive Technical Overview of its 250 kPa Absolute Pressure Sensing Capabilities
- Unveiling the NXP MC9S12XDP512CAG: A Comprehensive Exploration of the 16-bit HCS12X Microcontroller Family Flagship
- Unlocking High-Performance Embedded Design with the NXP MIMXRT1064DVL6B Crossover Processor
- Unlocking the Potential of the NXP MC9S12DT256CPVE 16-bit Automotive Microcontroller
- NXP BFS17A: A Comprehensive Technical Overview of the General-Purpose NPN Bipolar Junction Transistor
- MCIMX6S7CVM08AD: NXP's i.MX 6SoloLite Processor for Embedded Innovation
- LPC1347FBD48: NXP's ARM Cortex-M3 Microcontroller for Efficient Embedded Design
- NXP S912XHZ512F1VAG: A High-Performance Automotive Microcontroller for Next-Generation Vehicle Applications
- Xiaomi XRING O3 Chip Leak – 4GHz+ Prime Core and Full Architecture Overhaul
- Tokyo Electron Cuts Ties with China Chief Over Secret Startup Ties
- Bosch Launches 3rd‑Gen SiC Chip – 20% Performance Leap for EVs
- Diodes AL8859Q – Automotive SPI Boost Controller for Headlight Systems
- Japan 7.7 Magnitude Earthquake Hits Semiconductor Hub – Kioxia & Tokyo Electron Report No Damage
- UMC and eMemory Restart Memory Foundry in Japan – 2D NAND & NOR Flash
- Huawei Launches Kirin 9030S with 200% AI Performance Surge – Pura 90 Series First
- Chinese Semi Equipment Leader ACM Research Plans Hong Kong Listing
- Yuanjie Technology Tops 1,410 Yuan, Dethrones Moutai as A-Share “Stock King”
- ASE Invests $443M to Acquire Innolux Fab – Advanced Packaging Capacity Surges